Baikowski®Japan

Polishing Slurries Expertise

Situated in Narashino, Chiba, Baikowski® Japan has experienced remarkable growth since its inception in 1988. Nowadays, with more than 60 employees, the company is dedicated to pioneering the development and production of polishing slurries tailored for a wide range of single and composite materials with a focus on Chemical Mechanical Planarization (CMP) applications.

Indeed, through the utilization of polishing and measuring equipment, Baikowski® Japan has successfully formulated optimal solutions, based on a wide variety of abrasive grains (alumina, silica, ceria, diamond, etc.) and various chemical agents. They are meticulously engineered to meet the stringent requirements of cutting-edge industries, particularly when precision and/or selectivity in material removal are required like electronic components, semiconductors, magnetic media, and optical products.

Premium and Innovative polishing Solutions

The customization of polishing slurry has led to the accumulation of diverse know-how in the process. This expertise has not only enhanced the efficiency of current polishing process that uses general-purpose polishing slurry, but also enabled drastic improvements in manufacturing costs and product performance.

Fostering a culture of continuous improvement, Baikowski® Japan empowers its team of highly skilled operators to explore driving advancements that shape the future of polishing in critical industries.