HK
HK Series of Diamond Slurry is optimized for lapping GaN and SiC wafer.
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Baikowski® offers a wide range of polishing pads which are optimized for various applications such as sapphire, ceramics, metals...
Standard Pad products (Typical values) |
PuBS-P70 | PuBS-X20 | PuBS-W19 |
Material | Polyurethane | Non-woven | Suede |
Thickness (mm) | 1.3 | 1.8 | 0.95 |
Hardness (Asker A) | 75 | 75 | 67 |
The combination of Baikowski® pads & polishing slurries enables high-end surface finish with optimal performance. The recommended pad is different depending on targeted roughness and flatness. Baikowski® will be pleased to provide assistance in pad selection.
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